Microsoft’s Surface Neo, Lenovo’s ThinkPad X1 Fold, and a new variant of Samsung’s Galaxy Book S already have the Intel Lakefield processors. The company has been dropping several bits of information about the CPUs meant mainly for mobile computing devices with unique form-factors such as foldable PCs, dual-screen smartphones, etc. Now Intel has officially offered detailed information about the processors that adopt big.LITTLE arrangement of cores for maximizing performance, efficiency, and battery life.
Intel officially launched the Intel Core processors with Intel Hybrid Technology, code-named “Lakefield.” The CPUs leverage Intel’s Foveros 3D packaging technology and feature a hybrid CPU architecture for power and performance scalability. These processors are quite important to Intel as they are by far the smallest pieces of semiconductors that are able to deliver Intel Core performance. Moreover, these CPUs can offer full Microsoft Windows OS compatibility including productivity and content creation tasks within ultra-light and innovative form factors.
Intel Lakefield brings Foveros to life Hybrid processors to enable smaller and power efficient laptops: Intel Lakefield, the first mobile processors from Intel to use their Foveros technology is finally here and by the looks of it, is designed to help… https://t.co/mL2QdjSKnl pic.twitter.com/IHYTqBFbaV
— MaxIT (@maxitonline) June 10, 2020
Intel Lakefield Processors To Compete Against Qualcomm Snapdragon and ARM CPUs?
Intel assures the Lakefield CPUs can deliver full Windows 10 application compatibility in up to a 56 percent smaller package area for up to 47 percent smaller board size when compared to a Core i7-8500Y. They can offer extended battery life for several form-factor devices. This directly provides OEMs more flexibility in form factor design across single, dual, and foldable screen devices. These features should essentially allow consumers to experience a complete Windows 10 OS usage experience on a small and lightweight device with exceptional mobility.
These new CPUs could compete directly with Qualcomm’s Snapdragon as well as ARM processors. They feature the tried and tested big.LITTLE architecture which comprises of performance as well as efficiency-optimized cores for optimum performance and battery life. Intel claims that standby power can be as low as 2.5mW. This is a 91 percent reduction compared to Intel’s current-generation lowest-power processors from the Intel Y-series.
— iJR Software (@ijrsoftware) June 10, 2020
The Intel Lakefield processors in the current generation have a total of five cores. These are not Hyperthreaded. Only a single Core is classified as ‘Big’, which is a performance core, while the rest are ‘Little’ cores. The new CPUs come in Core i5 and Core i3 variants. Intel and OEMs have revealed the Core i5-L16G7 and the Core i3-L13G4. The ’G’ in the name indicates Gen11 for 1.7x graphics performance over the UHD Graphics found in the Core i7-8500Y.
I spent some time with @Intel's mobile client platform, code-named “#Lakefield” this morning in Lego form. I have this Hybrid #CPU Architecture with Foveros 3D packaging mastered at 1,600,000nm! I'll let #intel handle the actual 10nm version! pic.twitter.com/g0zH3Eih0V
— Nathan Kirsch (@LegitReviews) June 10, 2020
Intel’s Lakefield CPUs fit in a mere 7W TDP profile and feature 0.8GHz and 1.4GHz clock speeds in the Core i3 and the Core i5, respectively. Needless to add, these aren’t meant for power and performance-intensive workloads. Instead, these CPUs will be embedded inside devices where power efficiency and compatibility are design priorities.
Although none of the devices with the Intel Lakefield CPUs come with Windows 10X, it is quite likely that Intel and Microsoft could jointly finetune these processors for the lightweight fork of Windows 10. There are persistent reports about the operating system meant for innovative designs and use cases.